JPS622775Y2 - - Google Patents
Info
- Publication number
- JPS622775Y2 JPS622775Y2 JP1981160053U JP16005381U JPS622775Y2 JP S622775 Y2 JPS622775 Y2 JP S622775Y2 JP 1981160053 U JP1981160053 U JP 1981160053U JP 16005381 U JP16005381 U JP 16005381U JP S622775 Y2 JPS622775 Y2 JP S622775Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resin layer
- integrated circuit
- semiconductor element
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/298—Semiconductor material, e.g. amorphous silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981160053U JPS5866646U (ja) | 1981-10-26 | 1981-10-26 | 混成集積回路の封止構造 |
| KR2019820003095U KR860000239Y1 (ko) | 1981-10-26 | 1982-04-20 | 혼성집적회로의 봉지구조 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981160053U JPS5866646U (ja) | 1981-10-26 | 1981-10-26 | 混成集積回路の封止構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5866646U JPS5866646U (ja) | 1983-05-06 |
| JPS622775Y2 true JPS622775Y2 (en]) | 1987-01-22 |
Family
ID=29952483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981160053U Granted JPS5866646U (ja) | 1981-10-26 | 1981-10-26 | 混成集積回路の封止構造 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5866646U (en]) |
| KR (1) | KR860000239Y1 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3539467B2 (ja) * | 1997-03-25 | 2004-07-07 | ミツミ電機株式会社 | 電子部品モジュール |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53139206U (en]) * | 1977-04-07 | 1978-11-04 |
-
1981
- 1981-10-26 JP JP1981160053U patent/JPS5866646U/ja active Granted
-
1982
- 1982-04-20 KR KR2019820003095U patent/KR860000239Y1/ko not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5866646U (ja) | 1983-05-06 |
| KR860000239Y1 (ko) | 1986-03-05 |
| KR830004331U (ko) | 1983-12-30 |
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